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XC6VHX380T-2FFG1924I

XC6VHX380T-2FFG1924I

XC6VHX380T-2FFG1924I

Xilinx Inc.

3.85mm mm 220 ps ns FPGAs Virtex?-6 HXT Series 1924-BBGA, FCBGA 1mm mm

SOT-23

XC6VHX380T-2FFG1924I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1924-BBGA, FCBGA
Number of Pins 1924
Operating Temperature-40°C~100°C TJ
PackagingTray
Published 2008
Series Virtex®-6 HXT
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.95V~1.05V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC6VHX380T
Number of Outputs 640
Qualification StatusNot Qualified
Number of I/O 640
RAM Size 3.4MB
Propagation Delay220 ps
Turn On Delay Time220 ps
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 382464
Total RAM Bits 28311552
Number of LABs/CLBs 29880
Speed Grade 2
Number of Registers 478080
Height Seated (Max) 3.85mm
Length 45mm
Width 45mm
RoHS StatusROHS3 Compliant
In-Stock:40 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XC6VHX380T-2FFG1924I Product Details

XC6VHX380T-2FFG1924I Description


The XC6VHX380T-2FFG1924I is a Virtex®-6 FPGA n for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins.



XC6VHX380T-2FFG1924I Features


  • 1.2 to 2.5V /O operation

  • Source-synchronous interfacing using ChipSyncTM technology

  • Digitally controlled impedance (DCI) active termination

  • Flexible fine-grained /O banking

  • High-speed memory, interface support with the integrated write-levelling capability

  • 40 nm copper CMOS process technology

  • 1.0V core voltage (-1, -2, -3 speed grades only)

  • Lower-power 0.9V core voltage option (-1L speed grade only)

  • High signal-integrity flip-chip packaging is available in

  • standard or Pb-free package options



XC6VHX380T-2FFG1924I Applications


  • Industrial


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