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XCMECH-FF1738

XCMECH-FF1738

XCMECH-FF1738

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FF1738 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 1738-BBGA, FCBGA
Supplier Device Package 1738-FCBGA (42.5x42.5)
PackagingTray
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS StatusROHS3 Compliant
In-Stock:3237 items

XCMECH-FF1738 Product Details

XCMECH-FF1738 Overview


The ICs is enclosed in the package 1738-BBGA, FCBGA.It is used as integrated circuit system of the Tray package.The mounting method is Surface Mount.This type of Mechanical Sample can be found in many integrated circuits.This ICs complete is packaged by 1738-FCBGA (42.5x42.5).

XCMECH-FF1738 Features


Supplier Device Package : 1738-FCBGA (42.5x42.5)

XCMECH-FF1738 Applications


There are a lot of Xilinx Inc. XCMECH-FF1738 Specialized ICs applications.

  • Membrane Keypads
  • μP Switch Interfacing
  • All converters requiring very low standby power
  • Digital Still Cameras
  • Ecosystem Control
  • Portable Instruments
  • Printer Cartridge Identification and Authentication
  • Adapters requiring ultra low no-load consumption
  • All AC-DC converters with X capacitors of 100 nF up to 6 mF
  • PC-Based Instruments

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