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XCMECH-FF672

XCMECH-FF672

XCMECH-FF672

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FF672 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 672-BBGA, FCBGA
Supplier Device Package 672-FCBGA (27x27)
PackagingTray
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS StatusROHS3 Compliant
In-Stock:2016 items

XCMECH-FF672 Product Details

XCMECH-FF672 Overview


Integrated circuit is enclosed in a package 672-BBGA, FCBGA.The package Tray contains integrated circuit.Surface Mount is the way in which integrated circuit is mounted.The Mechanical Sample type is available in many integrated circuits.Packaging for the ICs complete is provided by 672-FCBGA (27x27).

XCMECH-FF672 Features


Supplier Device Package : 672-FCBGA (27x27)

XCMECH-FF672 Applications


There are a lot of Xilinx Inc. XCMECH-FF672 Specialized ICs applications.

  • Message Security
  • μP Switch Interfacing
  • IoT Node Authentication
  • Lossless generation of zero crossing signal
  • Peripheral Authentication
  • Membrane Keypads
  • Adapters requiring ultra low no-load consumption
  • Printer Cartridge Identification and Authentication
  • PDAs and Palmtop Devices
  • Anti-cloning

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