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XCR3384XL-12FTG256I

XCR3384XL-12FTG256I

XCR3384XL-12FTG256I

Xilinx

1mm PMIC 256 Pin 3.3V

SOT-23

XCR3384XL-12FTG256I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Number of Pins 256
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Additional FeatureYES
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count256
Qualification StatusNot Qualified
Operating Supply Voltage3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature GradeINDUSTRIAL
Number of I/O 212
Memory TypeEEPROM
Propagation Delay12 ns
Frequency (Max) 83MHz
Programmable Logic TypeEE PLD
Number of Gates9000
Number of Logic Blocks (LABs) 24
Speed Grade 12
Output FunctionMACROCELL
Number of Macro Cells 384
JTAG BST YES
In-System Programmable YES
Length 17mm
Height Seated (Max) 1.55mm
Width 17mm
RoHS StatusRoHS Compliant
In-Stock:4202 items

XCR3384XL-12FTG256I Product Details

XCR3384XL-12FTG256I Overview


A mobile phone network consists of 384macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).There are 212 I/Os programmed in it.The device is programmed with 256 terminations.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers and freight.Power is provided by a supply voltage of 3.3V volts.The chip is programmed with 256 pins.When using this device, YES can also be found.9000 gates are devices that serve as building blocks for digital circuits.For high efficiency, the supply voltage should be maintained at 3.3V.In order to store data, EEPROM is used.The electronic part is mounted by Surface Mount.The device is designed with pins 256.In this case, the maximum supply voltage (Vsup) reaches 3.6V.Ideally, the operating temperature should be greater than -40°C.It is recommended that the operating temperature be lower than 85°C.It is composed of 24 logic blocks (LABs).It is recommended that the maximal frequency be lower than 83MHz.Types of programmable logic are divided into EE PLD.

XCR3384XL-12FTG256I Features


212 I/Os
256 pin count
256 pins
24 logic blocks (LABs)


XCR3384XL-12FTG256I Applications


There are a lot of Xilinx
XCR3384XL-12FTG256I CPLDs applications.


  • Voltage level translation
  • Timing control
  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems
  • Portable digital devices

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