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XC6SLX9-N3CSG324I

XC6SLX9-N3CSG324I

XC6SLX9-N3CSG324I

Xilinx

1.2V V 1.5mm mm FPGAs BGA 0.8mm mm 324

SOT-23

XC6SLX9-N3CSG324I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case BGA
Number of Pins 324
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991.D
Terminal Finish TIN SILVER COPPER
Max Operating Temperature100°C
Min Operating Temperature -40°C
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Number of Outputs 200
Qualification StatusNot Qualified
Operating Supply Voltage1.2V
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.21.2/3.32.5/3.3V
Temperature GradeINDUSTRIAL
Number of I/O 200
RAM Size 72kB
Clock Frequency 806MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 9152
Number of Logic Blocks (LABs) 715
Number of Registers 11440
Combinatorial Delay of a CLB-Max 0.26 ns
Number of CLBs 715
Length 15mm
Height Seated (Max) 1.5mm
Width 15mm
RoHS StatusRoHS Compliant
In-Stock:4882 items

XC6SLX9-N3CSG324I Product Details

XC6SLX9-N3CSG324I Overview


This package is included in the BGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. With this device, you will be able to make use of 200 outputs. The total number of terminations is 324. During the configuration of this FPGA module, the RAM si72kBe reaches 72kB to ensure that the program runs normally. The device is designed with 324 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.32.5/3.3V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. In its basic building block, it is composed of 715 logic blocks (LABs), which are called building blocks. A crystal oscillating at 806MHz is one of the most common components of this device. A total of 11440 registers are used for storing and transferring data between them. CLBs are the building blocks of its architecture.

XC6SLX9-N3CSG324I Features


200 I/Os
324 LABs/CLBs
100°C gates
715 logic blocks (LABs)
11440 registers


XC6SLX9-N3CSG324I Applications


There are a lot of Xilinx
XC6SLX9-N3CSG324I FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio

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