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EPF8820ARC160-2

EPF8820ARC160-2

EPF8820ARC160-2

Intel

FPGAs FLEX 8000 Series 160-BQFP

SOT-23

EPF8820ARC160-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 160-BQFP
Supplier Device Package 160-PQFP (28x28)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX 8000
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~5.25V
Number of I/O 120
Number of Logic Elements/Cells 672
Number of Gates8000
Number of LABs/CLBs 84
In-Stock:1708 items

EPF8820ARC160-2 Product Details

EPF8820ARC160-2 Overview


The package that contains this software is called 160-BQFP. This device features 120 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 672 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 4.75V~5.25V . The FLEX 8000 Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~70°C TA when operating the machine. Using the Tray layout, this FPGA model can be contained in a very small amount of space. An array of 84 LABs/CLBs is built into the FPGA. Its basic building block contains 8000 gates. It employs 160-PQFP (28x28) as its supplier device package.

EPF8820ARC160-2 Features


120 I/Os

EPF8820ARC160-2 Applications


There are a lot of Intel EPF8820ARC160-2 FPGAs applications.

  • Random logic
  • Wireless Communications
  • Consumer Electronics
  • Data center hardware accelerators
  • Image processing
  • ASIC prototyping
  • Industrial IoT
  • Automotive advanced driver assistance systems (ADAS)
  • Wired Communications
  • High Performance Computing

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