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W25QUT16CVSNJP

W25QUT16CVSNJP

W25QUT16CVSNJP

WINBONDELECTRONICS

W25QUT16CVSNJP datasheet pdf and Backplanes product details from WINBONDELECTRONICS stock available on our website

SOT-23

W25QUT16CVSNJP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 2 days ago)
Lifecycle Status -
Mount Cable, Free Hanging
Mounting Type Surface Mount
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 6
Operating Temperature 0°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1
Number of Terminations 9
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply -
Base Part Number Impg Ubw
Output Voltage 65 V
Output Type Analog Voltage
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current 10 mA
Output Current 30 mA
Max Supply Current 700 μA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:3569 items

About W25QUT16CVSNJP

The W25QUT16CVSNJP from WINBONDELECTRONICS is a high-performance microcontroller designed for a wide range of embedded applications. This component features W25QUT16CVSNJP datasheet pdf and Backplanes product details from WINBONDELECTRONICS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the W25QUT16CVSNJP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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