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658-60ABT2

658-60ABT2

658-60ABT2

Wakefield-Vette

658-60ABT2 datasheet pdf and Thermal - Heat Sinks product details from Wakefield-Vette stock available on our website

SOT-23

658-60ABT2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Adhesive
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
PackagingBulk
Published 2001
Series 658
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Construction FIN
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.598 15.20mm
Thermal Resistance @ Forced Air Flow 2.00°C/W @ 500 LFM
Natural Thermal Resistance 2 °C/W
Profile PIN FIN ARRAY
Power Dissipation @ Temperature Rise 2.5W @ 30°C
Fin Orientation OMNIDIRECT
Height 15.24mm
Length 1.100 27.94mm
Width 1.100 27.94mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2118 items

About 658-60ABT2

The 658-60ABT2 from Wakefield-Vette is a high-performance microcontroller designed for a wide range of embedded applications. This component features 658-60ABT2 datasheet pdf and Thermal - Heat Sinks product details from Wakefield-Vette stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 658-60ABT2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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