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658-25ABT2

658-25ABT2

658-25ABT2

Wakefield-Vette

HEATSINK CPU 28MM SQ BLK W/TAPE

SOT-23

658-25ABT2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Adhesive
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
PackagingBulk
Published 2001
Series 658
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 500 LFM
Power Dissipation @ Temperature Rise 2.0W @ 40°C
Height 6.35mm
Length 1.100 27.94mm
Width 1.100 27.94mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4550 items

About 658-25ABT2

The 658-25ABT2 from Wakefield-Vette is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK CPU 28MM SQ BLK W/TAPE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 658-25ABT2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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