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VJ06UT03D130FLPAP

VJ06UT03D130FLPAP

VJ06UT03D130FLPAP

VISHAYVITRAMON

VJ06UT03D130FLPAP datasheet pdf and Backplanes product details from VISHAYVITRAMON stock available on our website

SOT-23

VJ06UT03D130FLPAP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 2 days ago)
Lifecycle Status 12 Weeks
Mount Through Hole
Mounting Type Press Fit, Through Hole
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 4
Operating Temperature -55°C ~ 150°C
Packaging Tape & Reel (TR)
Pbfree Code yes
Part Status -
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 4
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors
Voltage - Supply 10V ~ 40V
Base Part Number Inar Wksur
Output Voltage 16 V
Output Type Analog Voltage
Interface Analog
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current 1.5 mA
Output Current 70 mA
Max Supply Current 10 mA
Slew Rate -
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4354 items

About VJ06UT03D130FLPAP

The VJ06UT03D130FLPAP from VISHAYVITRAMON is a high-performance microcontroller designed for a wide range of embedded applications. This component features VJ06UT03D130FLPAP datasheet pdf and Backplanes product details from VISHAYVITRAMON stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the VJ06UT03D130FLPAP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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