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MBB0UT2070C9103FRP00

MBB0UT2070C9103FRP00

MBB0UT2070C9103FRP00

VISHAYBCCOMPONENTS

MBB0UT2070C9103FRP00 datasheet pdf and Backplanes product details from VISHAYBCCOMPONENTS stock available on our website

SOT-23

MBB0UT2070C9103FRP00 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status -
Mount Through Hole
Mounting Type Press Fit, Through Hole
Package / Case TO-220-3
Number of Pins 8
Operating Temperature -40°C ~ 125°C
Packaging Tube
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 5
ECCN Code -
Temperature Coefficient -
Subcategory Operational Amplifier
Voltage - Supply 20V ~ 50V
Base Part Number Dcgq Bsebtw
Output Voltage 31 V
Output Type N-Channel
Interface I2C, SPI
Termination Type -
Operating Supply Current 800 μA
Nominal Supply Current 800 μA
Output Current 30 mA
Max Supply Current 1 μA
Slew Rate 0.6V/μs
Architecture -
Amplifier Type -
In-Stock:4576 items

About MBB0UT2070C9103FRP00

The MBB0UT2070C9103FRP00 from VISHAYBCCOMPONENTS is a high-performance microcontroller designed for a wide range of embedded applications. This component features MBB0UT2070C9103FRP00 datasheet pdf and Backplanes product details from VISHAYBCCOMPONENTS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MBB0UT2070C9103FRP00, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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