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TE0820-03-03EG-1EA

TE0820-03-03EG-1EA

TE0820-03-03EG-1EA

Trenz Electronic GmbH

TE0820-03-03EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0820-03-03EG-1EA Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~80°C
Series TE0820
Size / Dimension 1.57 x 1.97 40mmx50mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:2706 items

TE0820-03-03EG-1EA Product Details

TE0820-03-03EG-1EA Overview


A MPU Core module or board is used in the microcontroller.It has Zynq UltraScale+ XCZU3EG-1SFVC784E cores and is driven by a processor.In order to use the microcontroller, the default setting is 0°C~80°C.128MB is the size of the flash on the MCU electronics.Connectors of type B2B are the most common.The TE0820 Series is the group in which MCU chip belongs.A RAM size of 2GB is set in order to ensure that the software runs normally and that MCU chip does not crash.

TE0820-03-03EG-1EA Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB

TE0820-03-03EG-1EA Applications


There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.

  • Medical Instrumentation
  • Process Monitoring
  • Human Machine Control Panel
  • Weighing Scales
  • Test and Measurement
  • Industrial Automation
  • Healthcare Monitoring
  • Industrial Control
  • Data Acquisition
  • Closed Loop Motor Control

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