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DBB03IPM

DBB03IPM

DBB03IPM

Texas Instruments

DBB03IPM datasheet pdf and RF Misc ICs and Modules product details from Texas Instruments stock available on our website

SOT-23

DBB03IPM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 64-LQFP
Number of Pins 64
Weight 342.689036mg
PackagingTray
JESD-609 Code e4
Pbfree Code no
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Base Part Number DBB03
Function Baseband ASIC for Dolphin Chipset
Secondary Attributes Baseband ASIC for Dolphin Chipset
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Contains Lead
In-Stock:1232 items

DBB03IPM Product Details

DBB03IPM Overview


RF ICs with enhanced 64-LQFP packages are excellent with common characteristics.The Tray package houses this RF modulator.A Surface Mount-type PCB or development board can be used to place this RF modulator.An enhanced power dissipation control RF module featuring 64 pins.It is important that the operating RF switch IC's temperature is below 85°C.This RF switch IC should not operate at a temperature lower than -40°C.

DBB03IPM Features


64-LQFP package
Tray
64 pins

DBB03IPM Applications


There are a lot of Texas Instruments DBB03IPM RF Misc ICs and Modules applications.

  • RF/IF analog multiplexer
  • Radio links
  • Synchronous detection
  • Test and Measurement
  • Amplitude modulation
  • Broadband/CATV
  • Cellular base stations
  • Phase modulation
  • Demodulation
  • Quadrature detection

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