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PACC-CD007

PACC-CD007

PACC-CD007

Teledyne LeCroy

PIVOT SOLDER GND 2/PC

SOT-23

PACC-CD007 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mount Solder
Published 2005
Series HFP
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Tip - Type Solder-In Ground
Quantity 2 Pieces
RoHS StatusNon-RoHS Compliant
In-Stock:98 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$147.208545$147.208545
10$138.875986$1388.75986
100$131.015081$13101.5081
500$123.599133$61799.5665
1000$116.602956$116602.956

About PACC-CD007

The PACC-CD007 from Teledyne LeCroy is a high-performance microcontroller designed for a wide range of embedded applications. This component features PIVOT SOLDER GND 2/PC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PACC-CD007, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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