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3139UT38130

3139UT38130

3139UT38130

TECONNECTIVITYPOTTERBRUMFIELDRELAYS

3139UT38130 datasheet pdf and Backplanes product details from TECONNECTIVITYPOTTERBRUMFIELDRELAYS stock available on our website

SOT-23

3139UT38130 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 3 days ago)
Lifecycle Status 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Metal
Number of Pins 6
Operating Temperature -40°C ~ 110°C
Packaging Box
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) -
Number of Terminations 5
ECCN Code EAR99
Temperature Coefficient -
Subcategory Other Sensors
Voltage - Supply 8V ~ 36V
Base Part Number Wlxt Lcboj
Output Voltage 24 V
Output Type Transistor Driver
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current 700 μA
Output Current 90 mA
Max Supply Current 1.5 mA
Slew Rate 0.6V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4303 items

About 3139UT38130

The 3139UT38130 from TECONNECTIVITYPOTTERBRUMFIELDRELAYS is a high-performance microcontroller designed for a wide range of embedded applications. This component features 3139UT38130 datasheet pdf and Backplanes product details from TECONNECTIVITYPOTTERBRUMFIELDRELAYS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3139UT38130, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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