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1064542-1

1064542-1

1064542-1

TE Connectivity AMP Connectors

RF Cable Assemblies MICRO MIN SMT

SOT-23

1064542-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact MaterialCopper
Contact PlatingGold
Mount Cable
Package / Case SMD/SMT
Insulation Material FEP
Dielectric MaterialPolypropylene
Conductor MaterialCopper, Steel
Operating Temperature-40°C~105°C
Published 2006
Feature Shielded
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Color Black
Gender Female to Cable
Style SSMT to Cable
Frequency 6GHz
Insulation Resistance1GOhm
ELV Compliant
Max Voltage Rating (AC) 250V
Impedance50Ohm
Cable Length510mm
Wire/Cable Gauge 30 AWG
Wire/Cable Diameter 1.3208 mm
1st Connector SSMT Female Jack, Right Angle
2nd Connector Cable (Round)
Length 20.08 510.00mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:562 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.89000$11.89
10$10.81000$108.1
25$10.53960$263.49
50$9.72880$486.44
100$9.18840$918.84
250$8.37764$2094.41
500$7.83714$3918.57

About 1064542-1

The 1064542-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features RF Cable Assemblies MICRO MIN SMT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1064542-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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