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6364555-1

6364555-1

6364555-1

TE Connectivity / AMP

6364555-1 datasheet pdf and Rectangular Connectors - Board In, Direct Wire to Board product details from TE Connectivity / AMP stock available on our website

SOT-23

6364555-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Contact PlatingTin
PCB Mounting Orientation Vertical
Pbfree Code yes
Termination IDC
Connector Type Connector, Pin, Plug
Number of Positions 10
Max Operating Temperature-105°C
Min Operating Temperature -65°C
Number of Rows 2
Contact Finish - Mating NOT SPECIFIED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 2.54mm
Reach Compliance Code unknown
Approval Agency CSA, UL
Row Spacing - Mating 2.54 mm
Housing Color Black
ELV Compliant
Insulation Diameter -1.07 mm
Length 17.27mm
Width 7.06mm
Plating Thickness 2.54μm
Length - Tail 3.96mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:3942 items

Pricing & Ordering

QuantityUnit PriceExt. Price
250$1.96624$491.56

About 6364555-1

The 6364555-1 from TE Connectivity / AMP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 6364555-1 datasheet pdf and Rectangular Connectors - Board In, Direct Wire to Board product details from TE Connectivity / AMP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6364555-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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