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111037-6

111037-6

111037-6

TE Connectivity / AMP

111037-6 datasheet pdf and Rectangular Connectors - Board In, Direct Wire to Board product details from TE Connectivity / AMP stock available on our website

SOT-23

111037-6 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Contact PlatingTin
Mounting Type BOARD
Housing Material Polyester
Mounting Style STRAIGHT
Pbfree Code no
Termination IDT
Connector Type BOARD CONNECTOR
Number of Rows 4
Gender Male
Additional FeatureAMP-LATCH
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 5.08mm
Orientation Right Angle
Depth 11.93mm
Number of Conductors ONE
Reference Standard CSA, UL
Number Of PCB Rows 4
Number of Contacts 30
PCB Contact Pattern STAGGERED
Housing Color Black
Contact Style SQ PIN-SKT
Contact Pattern STAGGERED
Mating Contact Row Spacing 0.1 inch
Plating Thickness 200μin
Length - Termination 0.1 inch
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4344 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 111037-6

The 111037-6 from TE Connectivity / AMP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 111037-6 datasheet pdf and Rectangular Connectors - Board In, Direct Wire to Board product details from TE Connectivity / AMP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 111037-6, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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