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B-155-3803

B-155-3803

B-155-3803

TE Connectivity Aerospace, Defense and Marine

TE CONNECTIVITY / RAYCHEM B-155-3803 SOLDER SLEEVE, 2.7MM, BOX 100

SOT-23

B-155-3803 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact MaterialCopper
Contact PlatingTin
Mount Cable
Package / Case 100
Insulation Material Polyolefin, PO
Material PO, Polyolefin
Body Material Thermoplastic
Published 2004
Series SolderSleeve B-155
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Solder
Type Wire to Wire
Max Operating Temperature125°C
Min Operating Temperature -55°C
Color Clear
ELV Compliant
Wire/Cable Diameter 2.7 mm
Government Qualified No
Diameter 0.105 2.67mm
Height 42mm
Length 1.655 42.04mm
Diameter - Inside 2.7 mm
Radiation HardeningNo
REACH SVHC Unknown
RoHS StatusRoHS Compliant
In-Stock:4206 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.28000$1.28
10$1.12200$11.22
25$1.05600$26.4
50$1.01200$50.6
100$0.96800$96.8
250$0.88000$220
500$0.79200$396

About B-155-3803

The B-155-3803 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features TE CONNECTIVITY / RAYCHEM B-155-3803 SOLDER SLEEVE, 2.7MM, BOX 100.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B-155-3803, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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