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C0816X5R1A224M050AC

C0816X5R1A224M050AC

C0816X5R1A224M050AC

TDK Corporation

CAP CER 0.22UF 10V X5R 0306

SOT-23

C0816X5R1A224M050AC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount, MLCC
Package / Case 0306 (0816 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~85°C
PackagingTape & Reel (TR)
Published 2012
Series C
Size / Dimension 0.031Lx0.063W 0.80mmx1.60mm
Tolerance ±20%
JESD-609 Code e3
Feature Low ESL (Reverse Geometry)
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Temperature CoefficientX5R
Composition Ceramic
Applications Bypass, Decoupling
HTS Code8532.24.00.20
Capacitance 0.22μF
Voltage - Rated DC 10V
Depth 1.6mm
Case Code (Metric) 0816
Case Code (Imperial) 0306
Temperature Characteristics Code X5R
Multilayer Yes
Height 500μm
Length 0.8mm
Thickness (Max) 0.024 0.60mm
Thickness 889μm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:28847 items

Pricing & Ordering

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About C0816X5R1A224M050AC

The C0816X5R1A224M050AC from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 0.22UF 10V X5R 0306.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the C0816X5R1A224M050AC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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