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STGB30H60DF

STGB30H60DF

STGB30H60DF

STMicroelectronics

STGB30H60DF datasheet pdf and Transistors - IGBTs - Single product details from STMicroelectronics stock available on our website

SOT-23

STGB30H60DF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins 3
Operating Temperature-40°C~175°C TJ
PackagingCut Tape (CT)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Subcategory Insulated Gate BIP Transistors
Max Power Dissipation260W
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number STGB30
Element ConfigurationSingle
Input Type Standard
Power - Max 260W
Polarity/Channel Type N-CHANNEL
Collector Emitter Voltage (VCEO) 2.4V
Max Collector Current 60A
Reverse Recovery Time 110 ns
Collector Emitter Breakdown Voltage600V
Max Breakdown Voltage 600V
Test Condition 400V, 30A, 10 Ω, 15V
Vce(on) (Max) @ Vge, Ic 2.4V @ 15V, 30A
IGBT Type Trench Field Stop
Gate Charge105nC
Current - Collector Pulsed (Icm) 120A
Td (on/off) @ 25°C 50ns/160ns
Switching Energy 350μJ (on), 400μJ (off)
Gate-Emitter Voltage-Max 20V
RoHS StatusROHS3 Compliant
In-Stock:3012 items

STGB30H60DF Product Details

STGB30H60DF Description


This IGBT gadget was created employing a cutting-edge, exclusive trench gate and field stop structure. This IGBT series maximizes the efficiency of very high frequency converters by providing the ideal balance between conduction and switching losses. Additionally, an easier paralleling operation is produced by a positive VCE(sat) temperature coefficient and a very tight parameter distribution.



STGB30H60DF Features


  • High speed switching

  • Tight parameters distribution

  • Safe paralleling

  • Low thermal resistance

  • Short circuit rated

  • Ultrafast soft recovery antiparallel diode



STGB30H60DF Applications


  • Inverter

  • UPS

  • PFC


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