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SI4705-D50-GMR

SI4705-D50-GMR

SI4705-D50-GMR

Silicon Labs

SI4705-D50-GMR datasheet pdf and RF Receivers product details from Silicon Labs stock available on our website

SOT-23

SI4705-D50-GMR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Package / Case 20-UFQFN Exposed Pad
Surface MountYES
Operating Temperature-20°C~85°C
PackagingTape & Reel (TR)
Published 1997
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Applications General Purpose
HTS Code8542.39.00.01
Technology CMOS
Voltage - Supply 2.7V~5.5V
Terminal Position QUAD
Terminal FormNO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch0.5mm
Frequency 64MHz~108MHz
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count20
JESD-30 Code S-XQCC-N20
Qualification StatusNot Qualified
Operating Supply Voltage5.5V
Nominal Supply Current7.5mA
Data InterfacePCB, Surface Mount
Telecom IC Type BASEBAND CIRCUIT
Modulation or ProtocolFM
Antenna ConnectorPCB, Surface Mount
Height Seated (Max) 0.6mm
Length 3mm
Width 3mm
RoHS StatusRoHS Compliant
In-Stock:2713 items

Pricing & Ordering

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SI4705-D50-GMR Product Details

SI4705-D50-GMR Overview


For convenience, RF Receiver is included in the 20-UFQFN Exposed Pad package.As of Tape & Reel (TR), RF transmitter and receiver is package of packaged in this way.The supply voltage of this RF Receiver is 2.7V~5.5V.The main application for it is in General Purpose.A QUAD position is assigned to RF transmitter and receiver's terminals.Using a frequency of 64MHz~108MHz, it is very efficient.There are 20 terminations of RF Receiver in total.

SI4705-D50-GMR Features


20-UFQFN Exposed Pad package
64MHz~108MHz
20 terminations

SI4705-D50-GMR Applications


There are a lot of Silicon Labs SI4705-D50-GMR RF Receivers applications.

  • Mesh Network
  • Keyless Entry Systems
  • Lightings
  • Test Equipment
  • Low Bitrate ISM-band Communication Systems
  • WCDMA
  • Wireless infrastructure
  • Embedded Processor
  • Sensors
  • Microprocessor

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