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TLE-154-01-G-DV

TLE-154-01-G-DV

TLE-154-01-G-DV

Samtec Inc.

CONN RCPT 108POS 0.079 GOLD SMD

SOT-23

TLE-154-01-G-DV Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialPhosphor Bronze
Contact PlatingGold
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Housing Material Plastic
Operating Temperature-55°C~125°C
PackagingBulk
Published 2000
Series TLE
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Pass Through
Number of Positions 108
Color Black
Number of Rows 2
Fastening TypePush-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3.2A per Contact
Pitch 2.0066mm
Insulation Height 0.177 4.50mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Row Spacing - Mating 0.079 (2.00mm)
Lead Pitch 2mm
Number of Contacts 108
Housing Color Black
Height 4.32mm
Length 108mm
Width 4mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2126 items

About TLE-154-01-G-DV

The TLE-154-01-G-DV from Samtec Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN RCPT 108POS 0.079 GOLD SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TLE-154-01-G-DV, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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