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HLE-126-02-L-DV-LC

HLE-126-02-L-DV-LC

HLE-126-02-L-DV-LC

Samtec Inc.

HLE-126-02-L-DV-LC datasheet pdf and Rectangular Connectors - Headers, Receptacles, Female Sockets product details from Samtec Inc. stock available on our website

SOT-23

HLE-126-02-L-DV-LC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Published 2016
Series HLE
JESD-609 Code e3
Feature Board Lock
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle
Number of Positions 52
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional FeatureTIGER BEAM CONTACT
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 52
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 10.0μin 0.25μm
RoHS StatusROHS3 Compliant
In-Stock:599 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.50000$7.5

HLE-126-02-L-DV-LC Product Details

HLE-126-02-L-DV-LC Overview


Packaging is Receptacle.There is a mounting type of Surface Mount for this device.Packaging is performed using a Tube case.The product is a member of the HLE Series.To name a few, there is also TIGER BEAM CONTACT.Its Board Lock feature makes it more powerful in a number of ways.The device is operating at -55°C~125°C Operating Temperature.

HLE-126-02-L-DV-LC Features


HLE series

HLE-126-02-L-DV-LC Applications


There are a lot of Samtec Inc. HLE-126-02-L-DV-LC Rectangular Connectors applications.

  • Datacom
  • Communication
  • Transportation
  • Automotive Electronics
  • Instrumentation
  • Data Technology
  • Telecommunications
  • Military Technology
  • Industrial Automation
  • Embedded systems

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