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HLE-122-02-F-DV-P-TR

HLE-122-02-F-DV-P-TR

HLE-122-02-F-DV-P-TR

Samtec Inc.

2 RowsReceptacleSolderBeryllium CopperSurface MountTape & Reel (TR)GoldLiquid Crystal Polymer (LCP)44 PositionsFemale Socket

SOT-23

HLE-122-02-F-DV-P-TR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Series HLE
Feature Pick and Place
Part StatusActive
Termination Solder
Connector Type Receptacle
Number of Positions 44
Number of Rows 2
Voltage - Rated 400VAC
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 44
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 3.00μin 0.076μm
RoHS StatusROHS3 Compliant
In-Stock:3548 items

Pricing & Ordering

QuantityUnit PriceExt. Price
125$4.08000$510

HLE-122-02-F-DV-P-TR Product Details

HLE-122-02-F-DV-P-TR Overview


The product comes in a package of Receptacle.Surface Mount is the type of mounting for the device.The product is packaged in a Tape & Reel (TR) case.A product of the HLE Series, it belongs to the range of products of that series.A number of advantages can be derived from its Pick and Place feature.The device is operating at -55°C~125°C Operating Temperature.

HLE-122-02-F-DV-P-TR Features


HLE series

HLE-122-02-F-DV-P-TR Applications


There are a lot of Samtec Inc. HLE-122-02-F-DV-P-TR Rectangular Connectors applications.

  • Military Technology
  • Industrial Automation
  • Datacom
  • Automotive Electronics
  • Measuring & Control Technology
  • Embedded systems
  • Transportation
  • Telecommunications
  • Communication
  • Data Technology

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