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HLE-113-02-G-DV-P

HLE-113-02-G-DV-P

HLE-113-02-G-DV-P

Samtec Inc.

2 RowsReceptacleSolderBeryllium CopperSurface MountTubeGoldLiquid Crystal Polymer (LCP)26 PositionsFemale Socket

SOT-23

HLE-113-02-G-DV-P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Series HLE
JESD-609 Code e4
Feature Pick and Place
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Receptacle
Number of Positions 26
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
HTS Code8536.69.40.40
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 26
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 3.00μin 0.076μm
RoHS StatusROHS3 Compliant
In-Stock:1098 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.15000$5.15

HLE-113-02-G-DV-P Product Details

HLE-113-02-G-DV-P Overview


This product is packaged in a Receptacle carton.Surface Mount is the mounting type of the device.A Tube case is used for packaging.This is from the HLE Series.With its Pick and Place feature, it is more powerful in many ways.There is no operating temperature for the device.

HLE-113-02-G-DV-P Features


HLE series

HLE-113-02-G-DV-P Applications


There are a lot of Samtec Inc. HLE-113-02-G-DV-P Rectangular Connectors applications.

  • Measuring & Control Technology
  • Automotive Electronics
  • Industrial Automation
  • Telecommunications
  • Datacom
  • Transportation
  • Instrumentation
  • Communication
  • Embedded systems
  • Medical technology

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