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HLE-109-02-G-DV-TE-P

HLE-109-02-G-DV-TE-P

HLE-109-02-G-DV-TE-P

Samtec Inc.

2 Rows Receptacle Solder Beryllium Copper Through Hole Tube Gold Liquid Crystal Polymer (LCP) 18 Positions Female Socket

SOT-23

HLE-109-02-G-DV-TE-P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Published 2016
Series HLE
JESD-609 Code e4
Feature Pick and Place
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle
Number of Positions 18
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional FeatureTOP ENTRY
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Insulation Height 0.138 3.50mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1254 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.69000$3.69

HLE-109-02-G-DV-TE-P Product Details

HLE-109-02-G-DV-TE-P Overview


The packaging is Receptacle.Mounting type is Through Hole.To package the product, we use a Tube case.This product is from the HLE Series.Then there's TOP ENTRY, for example.A number of advantages are provided by its Pick and Place feature.Mounted by Through Hole.Device runs at -55°C~125°C Operating Temperature.

HLE-109-02-G-DV-TE-P Features


HLE series


HLE-109-02-G-DV-TE-P Applications


There are a lot of Samtec Inc.
HLE-109-02-G-DV-TE-P Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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