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HLE-106-02-F-DV-LC-P

HLE-106-02-F-DV-LC-P

HLE-106-02-F-DV-LC-P

Samtec Inc.

2 Rows Receptacle Solder Beryllium Copper Surface Mount Tube Gold Liquid Crystal Polymer (LCP) 12 Positions Female Socket

SOT-23

HLE-106-02-F-DV-LC-P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Series HLE
Feature Board Lock, Pick and Place
Part StatusActive
Termination Solder
Connector Type Receptacle
Number of Positions 12
Number of Rows 2
Voltage - Rated 400VAC
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 12
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 3.00μin 0.076μm
RoHS StatusROHS3 Compliant
In-Stock:1719 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.22000$3.22

HLE-106-02-F-DV-LC-P Product Details

HLE-106-02-F-DV-LC-P Overview


The product is packaged in Receptacle.This device is mounted in the Surface Mount position.It has been determined that a Tube case is necessary to package the product.There is a product in the HLE Series.There are a number of advantages to its Board Lock, Pick and Place feature.As a result, the device runs at -55°C~125°C Operating Temperature.

HLE-106-02-F-DV-LC-P Features


HLE series


HLE-106-02-F-DV-LC-P Applications


There are a lot of Samtec Inc.
HLE-106-02-F-DV-LC-P Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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