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ESQT-108-03-G-D-367

ESQT-108-03-G-D-367

ESQT-108-03-G-D-367

Samtec Inc.

2 RowsElevated SocketSolderPhosphor BronzeThrough HoleBulkGoldLiquid Crystal Polymer (LCP)16 PositionsForked

SOT-23

ESQT-108-03-G-D-367 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingBulk
Series ESQT
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Elevated Socket
Number of Positions 16
Number of Rows 2
Gender Female
HTS Code8536.69.40.40
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Forked
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.5A per Contact
Insulation Height 0.367 9.33mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Row Spacing - Mating 0.079 (2.00mm)
Contact Length - Post 0.091 2.30mm
UL Flammability Code 94V-0
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1321 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.80000$5.8

ESQT-108-03-G-D-367 Product Details

ESQT-108-03-G-D-367 Overview


It comes in Elevated Socket packaging.Mounting type is Through Hole.Packaging is performed using a Bulk case.The product is a part of the ESQT Series.You've got Through Hole mounted on the part.Running in -55°C~125°C Operating Temperature.

ESQT-108-03-G-D-367 Features


ESQT series

ESQT-108-03-G-D-367 Applications


There are a lot of Samtec Inc. ESQT-108-03-G-D-367 Rectangular Connectors applications.

  • Data Technology
  • Measuring & Control Technology
  • Industrial Automation
  • Telecommunications
  • Medical technology
  • Embedded systems
  • Military Technology
  • Automotive Electronics
  • Communication
  • Datacom

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