Name: CLP-111-02-F-D
Brand: Samtec Inc.
SKU: CLP-111-02-F-D
Price: 2.96000 USD
Availability: InStock

new-10%

CLP-111-02-F-D

Manufacturer part number:CLP-111-02-F-D

Manufacturer:Samtec Inc.

Description:2 Rows Receptacle Solder Phosphor Bronze Surface Mount Bulk Gold Liquid Crystal Polymer (LCP) 22 Positions Female Socket

Case Package:SOT-23

Datasheet:CLP-111-02-F-D Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	1 Weeks
Contact Material	Phosphor Bronze
Mount	Surface Mount
Mounting Type	Surface Mount
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Housing Material	Polymer
Operating Temperature	-55°C~125°C
Packaging	Bulk
Published	2005
Series	CLP
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	Receptacle
Number of Positions	22
Number of Rows	2
Additional Feature	LOW PROFILE, E.L.P.
Fastening Type	Push-Pull
Subcategory	Headers and Edge Type Connectors
Voltage - Rated DC	340V
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Female Socket
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	3.3A per Contact
Total Number of Contacts	22
Orientation	Straight
Depth	3.05mm
Insulation Height	0.090 2.29mm
Style	Board to Board
Number of Positions Loaded	All
Pitch - Mating	0.050 1.27mm
Number of Conductors	ONE
Reference Standard	UL
Voltage - Rated AC	240V
Reliability	COMMERCIAL
Row Spacing - Mating	0.050 (1.27mm)
Number Of PCB Rows	2
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Housing Color	Black
Contact Resistance	10mOhm
Mating Contact Pitch	0.05 inch
Withdrawl Force-Min	.556 N
Length	14.4mm
Width	3.05mm
Plating Thickness	FLASH inch
Contact Finish Thickness - Mating	3.90μin 0.099μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

CLP-111-02-F-D Product Details

CLP-111-02-F-D Overview

A Receptacle package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Bulk case.It is part of the CLP Series of products.Additionally, there are other features, such as LOW PROFILE, E.L.P..Surface Mount mounts the part.There is no operating temperature for the device.