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CES-104-02-L-S

CES-104-02-L-S

CES-104-02-L-S

Samtec Inc.

1 RowsReceptacleSolderPhosphor BronzeThrough HoleBulkGoldPolybutylene Terephthalate (PBT)4 PositionsFemale Socket

SOT-23

CES-104-02-L-S Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polybutylene Terephthalate (PBT)
Operating Temperature-55°C~125°C
PackagingBulk
Series CES
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Receptacle
Number of Positions 4
Number of Rows 1
Gender Female
Additional FeatureLOW PROFILE
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Insulation Height 0.200 5.08mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.223 5.66mm
Contact Finish - Post Tin
Contact Finish Thickness - Mating 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:5422 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.93000$0.93

CES-104-02-L-S Product Details

CES-104-02-L-S Overview


Receptacle packaging is included.Through Hole is the mounting type for the device.It is necessary to use a Bulk case for packaging the product.This product is from the CES Series.Furthermore, there are other features such as LOW PROFILE, to name a few.Through Hole represents the mounting point for the part.There is no operating temperature for the device.

CES-104-02-L-S Features


CES series

CES-104-02-L-S Applications


There are a lot of Samtec Inc. CES-104-02-L-S Rectangular Connectors applications.

  • Medical technology
  • Measuring & Control Technology
  • Instrumentation
  • Military Technology
  • Data Technology
  • Embedded systems
  • Transportation
  • Industrial Automation
  • Communication
  • Datacom

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