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TLV5610IYZT

TLV5610IYZT

TLV5610IYZT

Rochester Electronics, LLC

DAC Voltage - Buffered Surface Mount String DAC R

SOT-23

TLV5610IYZT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 20-WFBGA, DSBGA
Supplier Device Package 20-DSBGA
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Output Type Voltage - Buffered
Number of Bits 12
Architecture String DAC
Reference TypeExternal
Data InterfaceSPI
Differential OutputNo
Voltage - Supply, Analog 2.7V~3.3V 5V
Voltage - Supply, Digital 2.7V~3.3V 5V
Settling Time7μs
INL/DNL (LSB) ±2, ±0.5
Number of D/A Converters 8
RoHS StatusROHS3 Compliant
In-Stock:568 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.64000$11.64
500$11.5236$5761.8
1000$11.4072$11407.2
1500$11.2908$16936.2
2000$11.1744$22348.8
2500$11.058$27645

TLV5610IYZT Product Details

TLV5610IYZT Overview


The package that contains this software is called 20-WFBGA, DSBGA. FPGA modules can be attached to development boards using a Surface Mount-connector. It is recommended that the operating temperature be kept within the range -40°C~85°C while the machine is operating. It is designed to maximiTape & Reel (TR)e space efficiency by containing the FPGA model in Tape & Reel (TR). The supplier of the device package is 20-DSBGA.

TLV5610IYZT Features


20-WFBGA, DSBGA package


TLV5610IYZT Applications


There are a lot of Rochester Electronics, LLC
TLV5610IYZT Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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