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FVP18030IM3LSG1

FVP18030IM3LSG1

FVP18030IM3LSG1

Rochester Electronics, LLC

FVP18030IM3LSG1 datasheet pdf and Power Driver Modules product details from Rochester Electronics, LLC stock available on our website

SOT-23

FVP18030IM3LSG1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Through Hole
Package / Case 19-PowerDIP Module (1.205, 30.60mm)
Series SPM®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Type IGBT
HTS Code8542.39.00.01
Voltage - Isolation 1500Vrms
Configuration Half Bridge
Voltage 300V
Current 180A
RoHS StatusROHS3 Compliant
In-Stock:519 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$17.60000$17.6
500$17.424$8712
1000$17.248$17248
1500$17.072$25608
2000$16.896$33792
2500$16.72$41800

About FVP18030IM3LSG1

The FVP18030IM3LSG1 from Rochester Electronics, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features FVP18030IM3LSG1 datasheet pdf and Power Driver Modules product details from Rochester Electronics, LLC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FVP18030IM3LSG1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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