Name: 801-87-025-10-001101
Brand: Preci-Dip
SKU: 801-87-025-10-001101
Price: 1.78000 USD
Availability: InStock

new-10%

801-87-025-10-001101

Manufacturer part number:801-87-025-10-001101

Manufacturer:Preci-Dip

Description:1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled25 PositionsFemale Socket

Case Package:SOT-23

Datasheet:801-87-025-10-001101 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Contact Material	Beryllium Copper
Mount	Through Hole
Mounting Type	Through Hole
Package / Case	SIP
Contact Shape	Circular
Insulation Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Housing Material	Polychlorinated
Operating Temperature	-55°C~125°C
Packaging	Bulk
Published	2011
Series	801
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	Socket
Number of Positions	25
Number of Rows	1
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Female Socket
Mixed Contacts	NO
Option	GENERAL PURPOSE
Orientation	Straight
Depth	2.54mm
Insulation Height	0.276 7.00mm
Style	Board to Board
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Contact Length - Post	0.118 3.00mm
Contact Finish - Post	Tin
UL Flammability Code	94V-0
Housing Color	Black
Contact Resistance	10mOhm
Max Voltage Rating (AC)	100V
Max Current Rating	3A
Length	63.5mm
Contact Finish Thickness - Mating	Flash
Material Flammability Rating	UL94 V-0
RoHS Status	ROHS3 Compliant

801-87-025-10-001101 Product Details

801-87-025-10-001101 Overview

A Socket package is included with it.Its mounting type is Through Hole.To package the product, a Bulk case is used.It belongs to the 801 Series of products.SIP indicates that the package contains an enclosed device.There's a Through Hole mount on the part.-55°C~125°C Operating Temperature is used by the device.