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801-87-016-10-132101

801-87-016-10-132101

801-87-016-10-132101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled16 PositionsFemale Socket

SOT-23

801-87-016-10-132101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-55°C~125°C
PackagingBulk
Published 2012
Series 801
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 16
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3A
Terminal Pitch2.54mm
Insulation Height 0.276 7.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.118 3.00mm
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:4229 items

Pricing & Ordering

QuantityUnit PriceExt. Price
600$1.08188$649.128

801-87-016-10-132101 Product Details

801-87-016-10-132101 Overview


Packaging for this item is Socket.A Through Hole mounting type is specified for the device.This product is packaged in a case marked Bulk.Among the products in the 801 Series, it is one of the most popular.It's mounted by Through Hole.The device runs in -55°C~125°C Operating Temperature.

801-87-016-10-132101 Features


801 series

801-87-016-10-132101 Applications


There are a lot of Preci-Dip 801-87-016-10-132101 Rectangular Connectors applications.

  • Telecommunications
  • Datacom
  • Transportation
  • Data Technology
  • Industrial Automation
  • Communication
  • Embedded systems
  • Military Technology
  • Instrumentation
  • Medical technology

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