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316-87-140-41-018101

316-87-140-41-018101

316-87-140-41-018101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled40 PositionsFemale Socket

SOT-23

316-87-140-41-018101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-55°C~125°C
PackagingBulk
Published 2012
Series 316
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 40
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3A
Terminal Pitch2.54mm
Insulation Height 0.276 7.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.126 3.20mm
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:2337 items

Pricing & Ordering

QuantityUnit PriceExt. Price
190$2.66074$505.5406

316-87-140-41-018101 Product Details

316-87-140-41-018101 Overview


It comes in Socket packaging.There is a Through Hole mounting type for the device.In order to package the product, a Bulk case is used.It is part of the 316 Series of products.There is a mounting hole at Through Hole.Running in -55°C~125°C Operating Temperature.

316-87-140-41-018101 Features


316 series

316-87-140-41-018101 Applications


There are a lot of Preci-Dip 316-87-140-41-018101 Rectangular Connectors applications.

  • Automotive Electronics
  • Communication
  • Instrumentation
  • Telecommunications
  • Military Technology
  • Embedded systems
  • Medical technology
  • Data Technology
  • Transportation
  • Datacom

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