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316-83-135-41-009101

316-83-135-41-009101

316-83-135-41-009101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled35 PositionsFemale Socket

SOT-23

316-83-135-41-009101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-55°C~125°C
PackagingBulk
Published 2012
Series 316
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 35
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3A
Terminal Pitch2.54mm
Insulation Height 0.512 13.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.126 3.20mm
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:1480 items

Pricing & Ordering

QuantityUnit PriceExt. Price
120$4.24200$509.04

316-83-135-41-009101 Product Details

316-83-135-41-009101 Overview


A Socket packaging is included.Through Hole is the mounting type.An Bulk case is utilized for packaging the product.Among the products in the 316 Series, it is one of the most popular.Part Through Hole is mounted to the part.-55°C~125°C Operating Temperature is the default.

316-83-135-41-009101 Features


316 series

316-83-135-41-009101 Applications


There are a lot of Preci-Dip 316-83-135-41-009101 Rectangular Connectors applications.

  • Measuring & Control Technology
  • Embedded systems
  • Communication
  • Industrial Automation
  • Medical technology
  • Data Technology
  • Military Technology
  • Automotive Electronics
  • Telecommunications
  • Transportation

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