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PN10-14SLF-L

PN10-14SLF-L

PN10-14SLF-L

Panduit Corp

PN10-14SLF-L datasheet pdf and Terminals - Spade Connectors product details from Panduit Corp stock available on our website

SOT-23

PN10-14SLF-L Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialCopper
Contact PlatingTin
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Nylon
Weight 122.46994g
Material - Insulation Polyamide (PA), Nylon
Body Material Copper
PackagingBulk
Series Pan-Term®
Published 2001
Feature Serrated Termination
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Crimp
Color Yellow
Depth 11.43mm
Contact Finish Tin
Wire Gauge10-12 AWG
Wire Gauge (Max) 12 AWG
Wire Gauge (Min) 10 AWG
Body Plating Tin
Insulation Diameter 0.225 (5.72mm)
Insulation Insulated
Terminal TypeSpring, Snap
Stud/Tab Size 1/4 Stud
Tongue Inside Opening 0.250 (6.35mm)
Length 25.654mm
Width 11.43mm
Length - Overall 1.010 25.65mm
Width - Outer Edges 0.450 11.43mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:1415 items

About PN10-14SLF-L

The PN10-14SLF-L from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features PN10-14SLF-L datasheet pdf and Terminals - Spade Connectors product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PN10-14SLF-L, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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