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PLF1MA-M

PLF1MA-M

PLF1MA-M

Panduit Corp

PLF1MA-M datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

PLF1MA-M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Polyamide (PA66), Nylon 6/6
Weight 757.499258g
Body Material Nylon, Polyamide
Packaging1000 per Pkg
Series PAN-TY® PLF
Published 2003
Feature Write-On Area
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Natural
Depth 2.5mm
Wire/Cable Diameter 1.5 mm
Tensile Strength18 lbs (8.16 kg)
Wire/Cable Color Natural
Wire/Cable Tie Type Marker Strap/Flag Tie
Bundle Diameter0.87 (22.10mm)
Height 3.9116mm
Length 130mm
Width 0.098 2.50mm
Length - Approximate 5
Length - Actual 0.425' 129.54mm 5.10
REACH SVHC No SVHC
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:22541 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About PLF1MA-M

The PLF1MA-M from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features PLF1MA-M datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PLF1MA-M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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