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PL3B5EH-C0

PL3B5EH-C0

PL3B5EH-C0

Panduit Corp

PL3B5EH-C0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

PL3B5EH-C0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Polyamide (PA66), Nylon 6/6
Weight 1.814369kg
Body Material Nylon
Packaging100 per Pkg
Series PAN-TY® BOW-TY™ PLB
Published 2000
Feature Weather Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Black
Depth 20.3mm
Tensile Strength125 lbs (56.70 kg)
Wire/Cable Tie Type Triple Head, Locking
Bundle Diameter5.00 (127.00mm)
Height 10.16mm
Length 508mm
Width 0.500 12.70mm
Length - Approximate 20
Length - Actual 1.667' 508.10mm
RoHS StatusROHS3 Compliant
In-Stock:2811 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.452373$3.452373
10$3.256956$32.56956
100$3.072600$307.26
500$2.898679$1449.3395
1000$2.734603$2734.603

About PL3B5EH-C0

The PL3B5EH-C0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features PL3B5EH-C0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PL3B5EH-C0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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