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HLSP3S-X12

HLSP3S-X12

HLSP3S-X12

Panduit Corp

HLSP3S-X12 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

HLSP3S-X12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Polypropylene Hook, Polyamide Loop
Weight 49.895161g
Body Material Nylon, Polypropylene
Packaging10 Rolls
Series TAK-TY® HLSP
Published 2005
Feature Plenum Rated
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature50°C
Min Operating Temperature -18°C
Color Maroon
Depth 19.1mm
Tensile Strength50 lbs (22.68 kg)
Wire/Cable Tie Type Hook and Loop - Strip
Bundle Diameter3.20 (81.28mm)
Height 2.5mm
Length 305mm
Width 0.750 19.05mm
Length - Approximate 12
Length - Actual 1.000' 304.80mm
RoHS StatusROHS3 Compliant
In-Stock:1748 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.05000$3.05
10$2.96900$29.69
25$2.88680$72.17
50$2.80440$140.22
100$2.72180$272.18
500$2.63936$1319.68

About HLSP3S-X12

The HLSP3S-X12 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features HLSP3S-X12 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HLSP3S-X12, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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