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H100X084H1T-2-B

H100X084H1T-2-B

H100X084H1T-2-B

Panduit Corp

Labels Heat Shrink Label Polyolefin White 25.4x21.3mm

SOT-23

H100X084H1T-2-B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyolefin
Weight 1.247379kg
Operating Temperature-55°C~135°C
Packaging5000 per Roll
Published 2014
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color White
Label Size 1.00 x 0.84 25.4mmx21.3mm
Label Type Heat Shrinkable, Two-Sided
RoHS StatusROHS3 Compliant
In-Stock:46 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About H100X084H1T-2-B

The H100X084H1T-2-B from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Labels Heat Shrink Label Polyolefin White 25.4x21.3mm.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H100X084H1T-2-B, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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