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H100X084H2C

H100X084H2C

H100X084H2C

Panduit Corp

Labels Heat Shrink Label Polyolefin Yellow 21.34x25.4mm

SOT-23

H100X084H2C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Polyolefin
Weight 190.508795g
Operating Temperature-55°C~135°C
Packaging75 per Cassette
Published 2009
Series PanTher™, P1™
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature135°C
Min Operating Temperature -55°C
Color Yellow
Label Size 1.00 x 0.84 25.4mmx21.3mm
Label Type Heat Shrinkable, Die-Cut
RoHS StatusROHS3 Compliant
In-Stock:97 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$103.72000$103.72
10$100.75900$1007.59
50$94.83200$4741.6
100$91.86850$9186.85

About H100X084H2C

The H100X084H2C from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features Labels Heat Shrink Label Polyolefin Yellow 21.34x25.4mm.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H100X084H2C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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