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DHC1.12X1.75-D0

DHC1.12X1.75-D0

DHC1.12X1.75-D0

Panduit Corp

DHC1.12X1.75-D0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

DHC1.12X1.75-D0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Polyamide (PA66), Nylon 6/6
Weight 1.995806kg
Body Material Nylon
Packaging500 per Pkg
Feature Weather Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Black
Depth 11.2mm
Tensile Strength100 lbs (45.36 kg)
Wire/Cable Tie Type Double Hose Clamp
Bundle Diameter1.12 (28.45mm), 1.75 (44.45mm)
Length 279mm
Width 0.280 7.11mm
Length - Approximate 11
Length - Actual 0.917' 279.40mm 11.00
RoHS StatusROHS3 Compliant
In-Stock:4337 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.715754$1.715754
10$1.618636$16.18636
100$1.527015$152.7015
500$1.440580$720.29
1000$1.359038$1359.038

About DHC1.12X1.75-D0

The DHC1.12X1.75-D0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features DHC1.12X1.75-D0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DHC1.12X1.75-D0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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