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CBR1M-M30

CBR1M-M30

CBR1M-M30

Panduit Corp

CBR1M-M30 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

CBR1M-M30 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Material Polyamide (PA66), Nylon 6/6
Weight 317.96828g
Body Material Nylon
Packaging1000 per Pkg
Series Contour-Ty® CBR
Published 2006
Feature Heat Stabilized
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Color Black
Depth 5mm
Tensile Strength18 lbs (8.16 kg)
Wire/Cable Tie Type Cable Tie, Parallel
Bundle Diameter1.00 (25.40mm)
Height 5.2832mm
Length 104.1mm
Width 0.098 2.50mm
Length - Approximate 4
Length - Actual 0.342' 104.24mm 4.10
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:90647 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.094000$0.094
500$0.069118$34.559
1000$0.057598$57.598
2000$0.052842$105.684
5000$0.049385$246.925
10000$0.045940$459.4
15000$0.044429$666.435
50000$0.043687$2184.35

About CBR1M-M30

The CBR1M-M30 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features CBR1M-M30 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CBR1M-M30, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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