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BT1M-M3

BT1M-M3

BT1M-M3

Panduit Corp

BT1M-M3 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

BT1M-M3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Package / Case Metal
Material Polyamide (PA66), Nylon 6/6
Weight 226.796213g
Body Material Nylon
Packaging1000 per Pkg
Series DOME-TOP® BARB-TY® BT
Published 2006
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Color Orange
Depth 4.4mm
Tensile Strength18 lbs (8.16 kg)
Wire/Cable Tie Type Standard, Locking
Bundle Diameter0.90 (22.86mm)
Height 3.9624mm
Length 102mm
Width 0.095 2.41mm
Length - Approximate 4
Length - Actual 0.333' 101.60mm 4.00
RoHS StatusROHS3 Compliant
In-Stock:114709 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.116394$0.116394
500$0.085584$42.792
1000$0.071320$71.32
2000$0.065431$130.862
5000$0.061151$305.755
10000$0.056884$568.84
15000$0.055014$825.21
50000$0.054094$2704.7

About BT1M-M3

The BT1M-M3 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features BT1M-M3 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BT1M-M3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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