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BC4LH-S25-L

BC4LH-S25-L

BC4LH-S25-L

Panduit Corp

BC4LH-S25-L datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

BC4LH-S25-L Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Screw
Mounting Type Screw Mount, Mounting Hole
Package / Case Metal
Material Polyamide (PA66), Nylon 6/6
Weight 385.553543g
Body Material Nylon
Packaging50 per Pkg
Series DOME-TOP® BARB-TY® BC
Published 1998
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Natural
Thread SizeM6
Wire/Cable Diameter 102 mm
Tensile Strength120 lbs (54.43 kg)
Wire/Cable Color Natural
Wire/Cable Tie Type Standard, Locking
Bundle Diameter4.00 (101.60mm)
Height 6.731mm
Length 4.7244m
Width 0.275 7.00mm
Length - Approximate 15.5
Length - Actual 1.292' 393.71mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:5629 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$1.16780$58.39
100$0.98100$98.1

About BC4LH-S25-L

The BC4LH-S25-L from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features BC4LH-S25-L datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BC4LH-S25-L, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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