Name: NTMYS3D3N06CLTWG
Brand: ON Semiconductor
SKU: NTMYS3D3N06CLTWG
Price: 3.03000 USD
Availability: InStock

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NTMYS3D3N06CLTWG

Manufacturer part number:NTMYS3D3N06CLTWG

Manufacturer:ON Semiconductor

Description:MOSFET N-CH 60V 100A

Case Package:SOT-23

Datasheet:NTMYS3D3N06CLTWG Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	33 Weeks
Mounting Type	Surface Mount
Supplier Device Package	LFPAK4 (5x6)
Operating Temperature	-55°C~175°C TJ
Packaging	Tape & Reel (TR)
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Terminal Finish	Tin (Sn)
Technology	MOSFET (Metal Oxide)
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Reach Compliance Code	not_compliant
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Power Dissipation-Max	3.9W Ta 100W Tc
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	3m Ω @ 50A, 10V
Vgs(th) (Max) @ Id	2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds	2880pF @ 25V
Current - Continuous Drain (Id) @ 25°C	26A Ta 133A Tc
Gate Charge (Qg) (Max) @ Vgs	40.7nC @ 10V
Drain to Source Voltage (Vdss)	60V
Drive Voltage (Max Rds On,Min Rds On)	4.5V 10V
Vgs (Max)	±20V
RoHS Status	ROHS3 Compliant

About NTMYS3D3N06CLTWG

The NTMYS3D3N06CLTWG from ON Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features MOSFET N-CH 60V 100A.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the NTMYS3D3N06CLTWG, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.