FDZ293P Description
FDZ293P is a 2.5v P-Channel Specified PowerTrench? BGA MOSFET. Combining Fairchild's advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ293P minimizes both PCB space and RDs(ON). The BGA MOSFET FDZ293P embodies a breakthrough in packaging technology that enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low Ros(ON).
FDZ293P Features
-4.6A, -20V RDs(ON)= 46 mΩ @ VGs=-4.5V
RDs(ON)= 72mΩ @ VGs=-2.5V
Occupies only 2.25 mm2 of PCB area Less than 50% of the area of an SSOT-6
Ultra-thin package: less than 0.85 mm in height when mounted to PCB
Outstanding thermal transfer characteristics: 4 times better than SSOT-6
Ultra-low Qg x RDs(ON) figure-of-merit
High power and current handling capability.
FDZ293P Applications
