FDZ203N Description
The FDZ203N lowers both PCB area and RDS by combining Fairchild's sophisticated 2.5V specified PowerTrench technology with state-of-the-art BGA packaging (ON). This BGA MOSFET represents a technological advance in packaging, as it combines good thermal transfer properties, high current handling capability, ultralow profile packing, low gate charge, and low RDS (ON).
FDZ203N Features
? 7.5 amps, 20 volts RDS(ON) = 18 m @ VGS = 4.5 RDS(ON) = 30 m @ VGS = 2.5 V RDS(ON) = 30 m @ VGS = 2.5 V
? Takes up only 4 mm2 of PCB space. A SSOT-6's surface area is less than 40%.
? Ultra-thin package with a height of less than 0.80 mm when mounted on PCB
? Qg x RDS(ON) figure-of-merit is really low.
? Able to handle a lot of power and current.
FDZ203N Applications
? Management of the battery
? On/off switch for the load
? Protection for the battery
